US Patent Issued to Hewlett Packard Enterprise Development on April 21 for "Chassis having trays to mount different form factor electronic modules to an electronic device" (Singaporean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,495, issued on April 21, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"Chassis having trays to mount different form factor electronic modules to an electronic device" was invented by See Yun Yow (Singapore), Mun Hoong Tai (Singapore) and Kai Siang Loh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chassis for an electronic device includes a tray and a frame. The tray is removably coupled to the frame and includes engagement members to engage with complementary engagement members of electronic modules mounted to the tray. The engagement members include pairs of engagement members disposed adjacent to each o...