US Patent Issued to Hewlett-Packard Development on March 17 for "Matching electrically conductive line resistances to switches in fluidic dies" (Oregon, California Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,633, issued on March 17, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).

"Matching electrically conductive line resistances to switches in fluidic dies" was invented by Vincent C. Korthuis (Corvallis, Ore.), Rogelio Cicili (San Diego), Eric T. Martin (Corvallis, Ore.), Kellie Susanne Jensen (Corvallis, Ore.) and James R. Przybyla (Corvallis, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a fluidic die includes fluidic actuators, switches, and electrically conductive lines in an electrically conductive layer of the fluidic die. The electrically conductive lines electrically connect the switches to respectiv...