ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,915, issued on Aug. 18, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).
"Microchannel structures with buried structures" was invented by Michael W. Cumbie (Corvallis, Ore.), Chien-Hua Chen (Corvallis, Ore.) and Richard W. Seaver (Corvallis, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A structure includes a plate layer formed of a first material and a plurality of heatsink structures vertically extending from the plate layer. Each of the plurality of heatsink structures includes a bottom structure disposed on the plate layer and formed of the first material, a buried structure disposed on the bottom structure and formed of...