ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,887, issued on April 21, was assigned to HERAEUS ELECTRONICS GMBH & Co. KG (Hanau, Germany).
"Sn-based alloy solder pastes" was invented by Peter Prenosil (Hanau, Germany), Sebastian Fritzsche (Hanau, Germany) and Katja Stenger (Hanau, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "Alloy comprising 90 to 96.8 wt. % of tin; 0.1 to 2.0 wt. % of silver; 2.0 to 4.0 wt. % of bismuth; 1.0 to 2.0 wt. % of antimony; 0.1 to 1.0 wt. % of copper; and 0.01 to 1 wt. % of germanium."
The patent was filed on March 15, 2022, under Application No. 18/558,300.
*For further information, including images, charts and tables, please visit: http://patft.uspto.g...