ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,619, issued on Sept. 9, was assigned to HEPTAGON PHOTONICS PTE. LTD. (Singapore).
"Wafer alignment features" was invented by Nicola Spring (Ziegelbrucke, Switzerland) and Uros Markovic (Zurich).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a plurality of optical elements includes providing a first wafer (200) having lower alignment features (192) arranged on a first surface of the substrate, providing a second wafer (201) comprising, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of the optical elements, the second wafer (201) further comprising uppe...