ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,344, issued on March 17, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"One component (1K) composition based on epoxy resin" was invented by Chunfu Chen (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is directed to an one-component (1K) composition comprising, based on the weight of the composition: from 40 to 98 wt. % of a) at least one epoxy resin; from 0.5 to 30 wt. % of b) at least one organoboron compound selected from tetrasubstituted borate salts of monovalent cations of tertiary amines; and, from 0.5 to 30 wt. % of c) at least one (meth)acrylamide monomer of Formula (VII): wherein: Ra is...