ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,019, issued on June 2, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"Method of bonding substrates" was invented by Michael Doherty (Clane, Ireland), Brian Deegan (Blessington, Ireland), Stephen Fearon (Swords, Ireland), David Condron (Dublin) and Barry Burns (Dublin).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of bonding first and second substrates to each other the substrates having respective bonding surfaces to be bonded together, comprising: (a) applying to the bonding surface of at least the first substrate a redox-active metal catalyst primer to form a primed surface; (b) activating the primed bonding surface of the f...