US Patent Issued to HENKEL on July 28 for "Hot melt adhesive" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,421, issued on July 28, was assigned to HENKEL AG & Co. KGaA (Duesseldorf, Germany).

"Hot melt adhesive" was invented by Ai Takamori (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a hot melt adhesive comprising: (A) a copolymer of ethylene with an olefin having 3 to 20 carbon atoms; (B) an ethylene-carboxylic acid ester copolymer; and (C) a tackifying resin, wherein the (B) ethylene-carboxylic acid ester copolymer comprises (B1) an ethylene-(meth)acrylic acid ester copolymer containing a structural unit derived from the (meth)acrylic acid ester in an amount of 2 to 24% by mass."

The patent was filed on June 1, 2023, under...