ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,586, issued on Dec. 23, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"Thermal conductive potting composition" was invented by Lei Huang (Shanghai), Hao Wu (Shanghai), Xueyu Qiu (Shanghai) and Xuan Xie (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "This invention relates to a thermal conductive potting composition. In particular, the present invention relates to a thermal conductive potting composition having a low viscosity, a high thermal conductivity, a high toughness and excellent thermal shock performance for new energy vehicles."
The patent was filed on April 26, 2021, under Application No. 17/239,789.
*For further i...