ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,412, issued on Dec. 2, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"Three-dimensionally patternable thermal interface" was invented by Pradyumna Goli (Prior Lake, Minn.), Reid J. Chesterfield (Eden Prairie, Minn.), Matthew Bren (Waconia, Minn.) and Kevin Olson (St. Paul, Minn.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional geometry of a thermal interface body may be customized to substantially fill an irregular gap along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive deposition process, wherein sequential patterns of thermal interface material a...