ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,436, issued on Dec. 2, was assigned to HENKEL AG & Co. KGaA (Duesseldorf, Germany).
"Hot melt composition" was invented by Masaaki Dobashi (Yokohama, Japan), Takahide Morishita (Osaka, Japan) and Koji Shirai (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An objective of the present invention is to provide a hot melt composition having a high form maintaining property at a high temperature and being in excellent adhesion to a substrate and in disassembly. The present invention relates to a hot melt composition comprising: (A1) a styrene-ethylene-ethylene/propylene-styrene block copolymer (SEEPS) and (B1) a hydrocarbon-based oil having an...