ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,425, issued on Aug. 4, was assigned to HENKEL AG & Co. KGaA (Duesseldorf, Germany).
"Hot melt adhesive" was invented by Ai Takamori (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a hot melt adhesive comprising: (A) a copolymer of ethylene with an olefin having 3 to 20 carbon atoms; (B) a copolymer of ethylene with a carboxylic acid derivative having an ethylenic double bond; and (C) a tackifying resin, wherein the (B) copolymer of ethylene with a carboxylic acid derivative having an ethylenic double bond comprises (B1) a copolymer of ethylene with a (meth)acrylic acid derivative, which copolymer (B1) has a melt flow rate of...