US Patent Issued to HEFEI SMAT TECHNOLOGY on Dec. 16 for "Exposed bonding pad of chip package and manufacturing method thereof" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,153, issued on Dec. 16, was assigned to HEFEI SMAT TECHNOLOGY Co. LTD. (Hefei, China).

"Exposed bonding pad of chip package and manufacturing method thereof" was invented by Guangyao Zhang (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is an exposed bonding pad of a chip package and a manufacturing method thereof. The manufacturing method comprises: before the package body is cut, forming a protruding bonding pad on the package body to replace a step of synchronously forming solder pins while forming a conductive layer group in the package body. Cutting grooves is each arranged at a position of a corresponding scribe line to ...