US Patent Issued to Hefei BOE Ruisheng Technology, BOE Technology Group on June 23 for "Wiring substrate and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,533, issued on June 23, was assigned to Hefei BOE Ruisheng Technology Co. Ltd. (Hefei, China) and BOE Technology Group Co. Ltd. (Beijing).

"Wiring substrate and electronic device" was invented by Jiawei Xu (Beijing), Zouming Xu (Beijing), Xintao Wu (Beijing), Xiaoxiang Zhang (Beijing), Jie Wang (Beijing), Ningyu Luo (Beijing) and Tingwei Han (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a base substrate, a plurality of constant voltage signal lines and a plurality of first connection lines, and a plurality of first pad regions. Each of the first pad regions includes a plurality of sub-regions. Each of the sub-re...