US Patent Issued to Hefei BOE Ruisheng Technology, BOE Technology Group on Aug. 11 for "Wiring substrate and method for preparing same, light-emitting substrate, and display device" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,782, issued on Aug. 11, was assigned to Hefei BOE Ruisheng Technology Co. Ltd. (Hefei, China) and BOE Technology Group Co. Ltd. (Beijing).

"Wiring substrate and method for preparing same, light-emitting substrate, and display device" was invented by Jie Lei (Beijing), Jian Tian (Beijing), Chunjian Liu (Beijing), Jianying Zhang (Beijing), Yajun Ma (Beijing) and Jiawei Xu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a wiring substrate. The wiring substrate includes: a base, including a functional region, a bonding region, and a connecting region; a first conductive layer, disposed on a side of the base and in the functional regi...