US Patent Issued to HEFEI BOE DISPLAY TECHNOLOGY, BOE TECHNOLOGY GROUP on July 14 for "Circuit board, chip on film, display apparatus and bonding method" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,699, issued on July 14, was assigned to HEFEI BOE DISPLAY TECHNOLOGY Co. LTD. (Hefei, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Circuit board, chip on film, display apparatus and bonding method" was invented by Yunyun Liang (Beijing), Changcheng Liu (Beijing), Jiantao Liu (Beijing), Liugang Zhou (Beijing), Jianwei Sun (Beijing), Liu He (Beijing), Jun Wang (Beijing), Qing Li (Beijing), Yu Quan (Beijing), Yanting Huang (Beijing), Yunlu Chen (Beijing) and Zhengru Pan (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a circuit board, a chip on film, a display apparatus and a bonding method. The circuit bo...