US Patent Issued to Harman International Industries on June 9 for "Electronics module immersion sealing with electromagnetic compatibility mitigation" (Michigan, Connecticut Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,749, issued on June 9, was assigned to Harman International Industries Inc. (Stamford, Conn.).

"Electronics module immersion sealing with electromagnetic compatibility mitigation" was invented by Alexander Tzinares (Ann Arbor, Mich.) and Jose Rodrigo Molotla (Stamford, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In at least one embodiment, an electronic module includes a first housing, a second housing, a printed circuit board (PCB), a ground contact, and a sealant. The first housing includes a first receiving portion. The second housing includes a second receiving portion, the second housing being coupled to the first housing defining a cav...