US Patent Issued to HANWHA SOLUTIONS on Feb. 17 for "Foam-molding mold having channels formed therein and physical foaming process using same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,074, issued on Feb. 17, was assigned to HANWHA SOLUTIONS Corp. (Seoul, South Korea).

"Foam-molding mold having channels formed therein and physical foaming process using same" was invented by Seong Soo Bae (Daejeon, South Korea), Chul Ee Kang (Daejeon, South Korea), Jae Hyeok Lee (Daejeon, South Korea), Won Jun Kang (Daejeon, South Korea) and Han Soo Song (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates to a foam-molding mold having channels formed therein and a physical foaming process using the same, and more specifically, the foam-molding mold is characterized by comprising a cavity formed therein for a...