ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,584, issued on Sept. 22, was assigned to HANWHA PRECISION MACHINERY Co. LTD. (Changwon-si, South Korea).
"Modularized bonding apparatus" was invented by Tae Woo Kang (Changwon-si, South Korea) and Ho Joon Shin (Changwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a bonding apparatus including a first wafer supplier including a plurality of load ports configured to store wafers having different sizes, the wafers including a plurality of substrate wafers and a plurality of die supply wafers, a first transferer adjacent to the first wafer supplier and configured to transfer the wafers, a first bonding device and a second...