US Patent Issued to HAMAMATSU PHOTONICS on Sept. 22 for "Film thickness measuring device and film thickness measuring method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,742,637, issued on Sept. 22, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Film thickness measuring device and film thickness measuring method" was invented by Kenichi Ohtsuka (Hamamatsu, Japan), Kazuya Iguchi (Hamamatsu, Japan) and Tomonori Nakamura (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film thickness measuring apparatus measures a film thickness of a sample during a manufacturing step. The film thickness measuring apparatus includes a lens focusing light (plasma light) generated in the manufacturing step and reflected by one surface of the sample, an inclined dichroic mirror having a transmissivity and a r...