US Patent Issued to HAMAMATSU PHOTONICS on Oct. 27 for "Method of manufacturing resin member, and resin member" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,374, issued on Oct. 27, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Method of manufacturing resin member, and resin member" was invented by Atsushi Nakanishi (Hamamatsu, Japan), Yuta Kine (Hamamatsu, Japan), Takeshi Watari (Hamamatsu, Japan), Takashi Kurita (Hamamatsu, Japan) and Hiroshi Satozono (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of manufacturing a resin member. The method includes irradiating a surface of a member containing a resin and a plant powder dispersed in the resin with laser light to change the plant powder or both the resin and the plant powder into diamond-like carbon...