US Patent Issued to HAMAMATSU PHOTONICS on Aug. 11 for "External resonant laser module and method of manufacturing external resonant laser module" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,435, issued on Aug. 11, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"External resonant laser module and method of manufacturing external resonant laser module" was invented by Atsushi Sugiyama (Hamamatsu, Japan), Tadataka Edamura (Hamamatsu, Japan), Takahide Ochiai (Hamamatsu, Japan) and Naota Akikusa (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The laser module includes a QCL element, a MEMS diffraction grating, a first lens holder disposed on a side opposite to a side on which the MEMS diffraction grating is disposed with respect to the QCL element, a second lens holder disposed between the QCL element and the ...