US Patent Issued to Guizhou University on March 3 for "Device and method for simulating and testing slump of backfill material in vertical borehole of closed-loop" (Chinese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,117, issued on March 3, was assigned to Guizhou University (Guizhou Province, China).

"Device and method for simulating and testing slump of backfill material in vertical borehole of closed-loop" was invented by Peng Pei (Guiyang City, China), Yumeng Wang (Guiyang City, China), Yixia Chen (Guiyang City, China) and Fengqiang Deng (Guiyang City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a device and a method for simulating and testing slump of a backfill material in a vertical borehole of a closed-loop. The device includes a lower pipe body, an upper pipe body, a cushion layer, and a press platen. The lower pipe body and the u...