ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,783, issued on Nov. 11, was assigned to GRAPHCORE Ltd. (Bristol, Great Britain).
"Communication between stacked die" was invented by Alexander MacFaden (Cheltenham, Great Britain) and Stephen Felix (Bristol, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a stacked integrated circuit device, there are two components, one in a first of the die and another in a second of the die. Each of the components is provided with two output connections, one leading above and one leading below the die, and two input connections, one leading above and one leading below the die, either of the two die. As a result of the redundancy, both die may be u...