US Patent Issued to Google on March 24 for "Weight optimized stiffener and sealing structure for direct liquid cooled modules" (California Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,510, issued on March 24, was assigned to Google LLC (Mountain View, Calif.).

"Weight optimized stiffener and sealing structure for direct liquid cooled modules" was invented by Madhusudan K. Iyengar (Foster City, Calif.), Connor Burgess (Alameda, Calif.), Padam Jain (San Jose, Calif.), Emad Samadiani (Cypress, Calif.) and Yuan Li (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the...