US Patent Issued to GM GLOBAL TECHNOLOGY OPERATIONS on June 16 for "Cure acceleration of thermal interface adhesives via adjacent component heating" (Michigan Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,402, issued on June 16, was assigned to GM GLOBAL TECHNOLOGY OPERATIONS (Detroit).

"Cure acceleration of thermal interface adhesives via adjacent component heating" was invented by Jared C. Harper (Lake Orion, Mich.) and Simon James Hammond Trask (Royal Oak, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the disclosure include systems and methods that leverage adjacent component heating to accelerate the cure time of thermal interface adhesives. An exemplary method can include receiving a battery pack and a thermal management system including a cooling plate, an upper tray, and a lower tray joined to opposite surfaces of the cooling...