US Patent Issued to Globalwafers on Sept. 22 for "Systems and methods for controlling surface profiles of wafers sliced in a wire saw" (American, Italian Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,741,397, issued on Sept. 22, was assigned to Globalwafers Co. Ltd. (Hsinchu, Taiwan).

"Systems and methods for controlling surface profiles of wafers sliced in a wire saw" was invented by Sumeet S. Bhagavat (St. Charles, Mo.), Carlo Zavattari (Varallo Pombia, Italy), Peter D. Albrecht (O'Fallon, Mo.) and William L. Luter (St. Charles, Mo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for controlling the surface profiles of wafers sliced in a wire saw machine. The systems and methods are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is alte...