US Patent Issued to GlobalWafers on Dec. 30 for "Ingot wafering systems and methods for slicing a silicon ingot" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,741, issued on Dec. 30, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Ingot wafering systems and methods for slicing a silicon ingot" was invented by Chia Ming Liu (Hsinchu, Taiwan), Chien Ming Chen (Hsinchu, Taiwan), Jui Hung Wang (Hsinchu, Taiwan) and Hao Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A slurry sprayer for supplying a slurry to a wire saw during ingot slicing is disclosed. The slurry sprayer includes a main body and a cover plate that is detachable from the main body for cleaning the slurry sprayer. In some embodiments, the slurry sprayer includes an adjustable support that allows the incline angle...