US Patent Issued to GlobalWafers on Dec. 16 for "Methods of processing semiconductor wafers using double side grinding operations" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,496,676, issued on Dec. 16, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Methods of processing semiconductor wafers using double side grinding operations" was invented by Tsunehiro Muronoi (Otawara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a semiconductor wafer includes placing the wafer in a carrier such that a first grinding wheel engages the front surface of the wafer and a second grinding wheel engages the back surface of the wafer. The method also includes performing a first grinding operation in which the first and second grinding wheels rotate in counter-rotation manner and the wafer is rotated in a...