US Patent Issued to GlobalWafers on April 7 for "Polishing head assembly having recess and cap" (Taiwanese, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,594,644, issued on April 7, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Polishing head assembly having recess and cap" was invented by Peter Daniel Albrecht (O'Fallon, Mo.), Chih Yuan Hsu (Hsinchu, Taiwan), Jen Chieh Lin (Hsinchu, Taiwan), Wei Chang Huang (Hsinchu County, Taiwan) and Yau-Ching Yang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a top portion and a recess along a bottom portion. The recess has a recessed surface. Holes extend from the top portion through the recessed surface. Th...