ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,683, issued on March 31, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.).
"Structure with inductor embedded in bonded semiconductor substrates and methods" was invented by Ravi P. Srivastava (Clifton Park, N.Y.) and Jagar Singh (Clifton Park, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a structure and a method of forming the structure. The structure includes first and second semiconductor substrates with adjacent surfaces (e.g., bonded surfaces), a first spiral-shape metallic feature in the first semiconductor substrate, and a second spiral-shaped metallic feature in the second semiconductor substrate. The second spiral...