US Patent Issued to GlobalFoundries U.S. on June 23 for "Structure including passive component traversing multiple semiconductor chips, with related methods and systems" (Indian, Singaporean, American Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,664,344, issued on June 23, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.).

"Structure including passive component traversing multiple semiconductor chips, with related methods and systems" was invented by Haritez Narisetty (Fremont, Calif.), Manubhai Patel Jignesh (Milpitas, Calif.), Ching Theng Lew (Singapore), Ananth Sundaram (Bangalore, India), Muhammed Shafi Kunnathodi (Malappuram, India), Praveen Paul Arotha (Bangalore, India) and Varuna AnanthaPadmanabha Baipadi (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure provide a structure including a passive component traversing multiple semiconductor...