US Patent Issued to GlobalFoundries U.S. on June 23 for "Fan-out co-packaged integrated systems including a photonic integrated circuit" (New York Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,585, issued on June 23, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.).

"Fan-out co-packaged integrated systems including a photonic integrated circuit" was invented by Jae Kyu Cho (Niskayuna, N.Y.) and Norman Robson (Fishkill, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Structures for a co-packaged photonics chip and electronic chip, and associated methods. The structure comprises a layer comprising a molding compound, an electronic chip and a photonics chip affixed in the layer, and a waveguiding structure including a waveguide core adjacent to the photonics chip. The photonics chip includes an optical coupler, the waveguide core ...