ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,724,448, issued on Sept. 1, was assigned to Global Unichip Corp. (Hsinchu, Taiwan) and Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device, interface device and operation method" was invented by Bi-Yang Li (Hsinchu, Taiwan), Igor Elkanovich (Hsinchu, Taiwan), Hung-Yi Chang (Hsinchu, Taiwan) and Shih-Cheng Kao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interface device is adapted for a semiconductor device including a first die and a second die. The first die and the second die are electrically connected to each other to be stacked into a 3D structure. The interface device includes a controllable d...