US Patent Issued to GLOBAL UNICHIP, TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Semiconductor chiplet device and interposer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,198, issued on July 14, was assigned to GLOBAL UNICHIP Corp. (Hsinchu City, Taiwan) and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor chiplet device and interposer" was invented by Liang-Kai Chen (Hsinchu City, Taiwan), Chih-Chiang Hung (Hsinchu City, Taiwan), Wen-Yi Jian (Hsinchu City, Taiwan), Yuan-Hung Lin (Hsinchu City, Taiwan) and Sheng-Fan Yang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chiplet device includes a first die, a second die, a decoupling circuit and an interposer. The interposer includes a plurality of power traces and a plurality of ground traces. The fi...