US Patent Issued to Gigaphoton on Sept. 29 for "Laser processing apparatus including a hole in a workpiece having a resin layer, laser processing method, and electronic device manufacturing method having the same" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,746,618, issued on Sept. 29, was assigned to Gigaphoton Inc. (Tochigi, Japan).

"Laser processing apparatus including a hole in a workpiece having a resin layer, laser processing method, and electronic device manufacturing method having the same" was invented by Yasufumi Kawasuji (Oyama, Japan), Yasuhiro Adachi (Oyama, Japan) and Akira Suwa (Oyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laser processing apparatus forms a hole in a workpiece having a resin layer on a processing surface by irradiating the workpiece with a laser beam discharge-excited between a pair of discharge electrodes, and includes a laser apparatus that outputs the la...