US Patent Issued to Genesee Valley Innovations on June 2 for "3D package for semiconductor thermal management" (California Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,333, issued on June 2, was assigned to Genesee Valley Innovations LLC (Santa Clara, Calif.).

"3D package for semiconductor thermal management" was invented by Christopher Chua (San Jose, Calif.), Joerg Martini (San Francisco), Mark Teepe (Palo Alto, Calif.), Yu Wang (San Jose, Calif.) and Qian Wang (Mountain View, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D package for semiconductor thermal management can include a 3D submount forming a mechanical block including at least one embedded channel formed within the mechanical block and configured to accept cooling liquid therethrough, a first tubular connection for providing cooling liquid ...