US Patent Issued to GENENTECH on July 7 for "High dimensional spatial analysis" (California Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,676,015, issued on July 7, was assigned to GENENTECH INC. (South San Francisco, Calif.).

"High dimensional spatial analysis" was invented by Xiao Li (Foster City, Calif.), Darya Yuryevna Orlova (Los Altos, Calif.), Joaquin Pechuan Jorge (San Francisco) and Rajiv Edillon Jesudason (Oakland, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for high dimensional spatial analysis includes segmenting, into a plurality of segments, an image depicting a plurality of cells comprising a biological sample. Each segment of the plurality of segments may correspond to one cell of the plurality of cells. A phenotype for each cell of the plurality of cells...