US Patent Issued to GEMTEK TECHNOLOGY on Sept. 8 for "Communication assembly and heat dissipation shielding module thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,272, issued on Sept. 8, was assigned to GEMTEK TECHNOLOGY Co. LTD. (Hsinchu, Taiwan).

"Communication assembly and heat dissipation shielding module thereof" was invented by Yen-Yu Lai (Hsinchu, Taiwan) and Chih Yao Hsu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A communication assembly is configured to be disposed on a substrate, and the communication assembly includes an optical fiber communication module and a heat dissipation shielding module. The optical fiber communication module is configured to be disposed on the substrate. The heat dissipation shielding module is configured for cooling the optical fiber communication mod...