US Patent Issued to GE Infrastructure Technology on April 21 for "Porous metal coupon with low porosity region for repairing component, component with same and related method" (South Carolina, New York Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,768, issued on April 21, was assigned to GE Infrastructure Technology LLC (Greenville, S.C.).

"Porous metal coupon with low porosity region for repairing component, component with same and related method" was invented by Stanley Frank Simpson (Greenville, S.C.), Mark Lawrence Hunt (Greenville, S.C.), Jacob Andrew Salm (Simpsonville, S.C.), James Warren Pemrick (Troy, N.Y.) and Nathan Nicholas Ostrout (Greenville, S.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A metal coupon for repairing a component includes an additively manufactured (AM) metal member having a low porosity region in an interior of the AM metal member, and a porous region arou...