ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,720, issued on Oct. 27, was assigned to FUZHOU BCE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Fuzhou, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).
"Array substrate with communicated vias, method for manufacturing same, and display panel" was invented by Bin Lin (Beijing), Yang Wang (Beijing), Jinliang Wang (Beijing), Qiming Li (Beijing), Zhenyou Zou (Beijing) and Zengrong Li (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an array substrate. The array substrate includes: a substrate, and a first electrode, a connecting electrode, and at least two insulating layers arranged on the substrate, wherein the first electrode is dispose...