US Patent Issued to FUJITSU GENERAL on Nov. 3 for "Heat pump apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,012, issued on Nov. 3, was assigned to FUJITSU GENERAL Ltd. (Kanagawa, Japan).

"Heat pump apparatus" was invented by Masahiro Kondo (Kanagawa, Japan), Daiki Shimano (Kanagawa, Japan) and Kazuki Suda (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump apparatus has a lower stage circuit, a higher stage circuit, a water circuit, a user terminal, and a control device. In a case where the control device determines that frost has been formed at a heat source heat exchanger and switches a first four-way valve to start first defrosting operation, and defrosting is not achieved; the control device controls a refrigerant circuit to swi...