US Patent Issued to FUJIMI on May 19 for "Polishing composition, polishing method, and method for producing semiconductor substrate" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,743, issued on May 19, was assigned to FUJIMI Inc. (Kiyosu, Japan).

"Polishing composition, polishing method, and method for producing semiconductor substrate" was invented by Tsutomu Yoshino (Kiyosu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a means capable of sufficiently removing residues on a surface of an object to be polished while polishing the object to be polished at a moderate speed.Provided is a polishing composition containing: anionically-modified colloidal silica; a dispersing medium; an anionic water-soluble polymer which is a copolymer including a structural unit having a sulfonic acid group or a salt group ther...