US Patent Issued to FUJIMI on March 31 for "Polishing composition, polishing method, and method for producing polished substrate" (Japanese, Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,225, issued on March 31, was assigned to FUJIMI Inc. (Aichi, Japan).

"Polishing composition, polishing method, and method for producing polished substrate" was invented by Shota Suzuki (Aichi, Japan) and Jingzhi Chen (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the present invention, a moderately high polishing speed for a specific material and appropriate ratio of polishing speeds between two or more different materials are achieved in polishing using a polishing composition. The present invention relates to a polishing composition comprising abrasive grains, a water-soluble polymer having no alcoholic hydroxy...