US Patent Issued to FUJIMI on July 21 for "Polishing composition, polishing method, and method for producing semiconductor substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,792, issued on July 21, was assigned to FUJIMI Inc. (Kiyosu, Japan).

"Polishing composition, polishing method, and method for producing semiconductor substrate" was invented by Ryota Mae (Kiyosu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing composition according to the present invention contains zirconia particles, a selectivity improver for improving a ratio of a polishing speed for an organic material (b) to a polishing speed for a material (a) having a metal-nitrogen bond, and a dispersing medium, wherein in a particle size distribution of the zirconia particles obtained by a laser diffraction/scattering method, a diameter (D5...