ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,540, issued on Dec. 16, was assigned to FUJIMI Inc. (Aichi, Japan).
"Polishing composition and polishing method using the same" was invented by Hooi-Sung Kim (Tualatin, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a polishing composition enabling an improved molybdenum removal rate while reducing etching of molybdenum (high Mo RR/Mo SER ratio) and simultaneously enabling a high ratio of molybdenum removal rate to silicon oxide removal rate (Mo:TEOS removal rate selectivity), wherein, the polishing composition comprises an abrasive, a molybdenum (Mo) removal rate enhancer, an organic acid, an oxidizer, a corro...