US Patent Issued to FUJIFILM on Oct. 20 for "Treatment liquid, cleaning method of semiconductor substrate, and manufacturing method of semiconductor element" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,767,908, issued on Oct. 20, was assigned to FUJIFILM Corp. (Tokyo).

"Treatment liquid, cleaning method of semiconductor substrate, and manufacturing method of semiconductor element" was invented by Nobuaki Sugimura (Haibara-gun, Japan) and Tetsuya Kamimura (Haibara-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a treatment liquid having excellent removability of a hydrophobic anticorrosion agent and excellent suppression property of copper surface roughness, a cleaning method of a semiconductor substrate, and a manufacturing method of a semiconductor element. The treatment liquid of the present...