US Patent Issued to FUJIFILM on May 19 for "Epoxy resin adhesive for medical device and cured product of the same, and medical device member and medical device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,752, issued on May 19, was assigned to FUJIFILM Corp. (Tokyo).

"Epoxy resin adhesive for medical device and cured product of the same, and medical device member and medical device" was invented by Kazushi Furukawa (Kanagawa, Japan) and Yoshihiro Nakai (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are an epoxy resin adhesive for a medical device and its cured product, and a medical device member and a medical device. The epoxy resin adhesive includes the following components (A) to (C): (A) an epoxy resin; (B) a polyamine compound having two or more unsubstituted amino groups; and (C) a compound having a nonaromatic carbon-c...