ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,450, issued on March 24, was assigned to FUJIFILM Corp. (Tokyo).

"Post-CMP cleaning liquid comprising a substituted benzene anticorrosive agent, chelant, and amine compound" was invented by Tetsuya Kamimura (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the invention is to provide a method of cleaning semiconductor substrates that is excellent in abrasive particle removing performance with respect to semiconductor substrates having undergone CMP, as well as a cleaning liquid for semiconductor substrates having undergone CMP. The invention provides a method of cleaning semiconductor substrates, the method comprising a c...