US Patent Issued to FUJIFILM on March 24 for "Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, method for manufacturing electronic device, and compound" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,585,187, issued on March 24, was assigned to FUJIFILM Corp. (Tokyo).

"Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, method for manufacturing electronic device, and compound" was invented by Masafumi Kojima (Haibara-gun, Japan), Akira Takada (Haibara-gun, Japan), Akiyoshi Goto (Haibara-gun, Japan), Takeshi Kawabata (Haibara-gun, Japan) and Aina Ushiyama (Haibara-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having a good shape can be obtained. Also provided is a resist film, a pattern formi...